362 lines
28 KiB
Plaintext
362 lines
28 KiB
Plaintext
(footprint "RPi_PicoW_SMD_TH" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61436715)
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(pad "35" smd rect (at 8.89 -11.43) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Mask") (tstamp e71e9a2a-2076-4135-853a-0b38d46fca16))
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(pad "36" thru_hole oval (at 8.89 -13.97) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp 20b4a9fd-06c0-445f-afed-146759f2bb5b))
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(pad "36" smd rect (at 8.89 -13.97) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Mask") (tstamp ee3d621e-237d-4382-b7e3-a9fcf17e4bec))
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(pad "37" thru_hole oval (at 8.89 -16.51) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp e0b2b98e-47e3-486b-a0ec-d7330e62b063))
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(pad "38" thru_hole rect (at 8.89 -19.05) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp efa4a51f-b208-4369-8af4-36e147e1f938))
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(pad "39" thru_hole oval (at 8.89 -21.59) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp cccd4cea-c88e-4fc0-907f-447edef8bc42))
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(pad "40" thru_hole oval (at 8.89 -24.13) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp f2e38f9a-9471-4d1c-a231-9b0e914557b6))
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(pad "42" thru_hole rect (at 3.1241 5.6) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp 0c7737c2-9ce5-4a7e-b469-773493986cc0))
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(pad "43" thru_hole oval (at 5.6641 5.6) (size 1.7 1.7) (drill 1.02) (layers *.Cu *.Mask) (tstamp 5f92749e-d901-43e2-9830-cd67adc28c43))
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)
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